Coronus DX builds on Lam’s 15-year heritage of innovation in bevel solutions
Bengaluru, NFAPost: Lam Research Corp introduced Coronus DX, the industry’s first bevel deposition solution optimised to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
As semiconductors continue to scale, manufacturing becomes increasingly complex with hundreds of process steps needed to build nanometer-sized devices on a silicon wafer.
In a single step, Coronus DX deposits a proprietary layer of protective film on both sides of the wafer edge that helps prevent defects and damage that can often occur during advanced semiconductor manufacturing.
This powerful protection increases yield and enables chipmakers to implement new leading-edge processes for the production of next-generation chips. Coronus DX is the newest addition to the Coronus® product family and extends Lam’s leadership in bevel technology.
Lam Research Senior Vice Present of Global Products Group Sesha Varadarajan said in the era of 3D chipmaking, production is complex and costly.
“Building on Lam’s expertise in bevel innovation, Coronus DX helps drive more predictable manufacturing and significantly higher yield, paving the way for adoption of advanced logic, packaging and 3D NAND production processes that weren’t previously feasible,” said Lam Research Senior Vice Present of Global Products Group Sesha Varadarajan.
Deposition Adds Critical Protection
Complementing Coronus bevel etch technology, Coronus DX is a game-changer for chipmakers by enabling new device structures. Repeated layers of processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a semiconductor device to fail. For example:
In 3D packaging applications, material from back-end-of-line can migrate and become a contamination source in future processing. Roll-off in the wafer edge profile can impact wafer bonding quality.
Long wet etch processes in 3D NAND manufacturing may result in severe substrate damage at the edge.
When those defects cannot be etched away, Coronus DX deposits a thin dielectric layer of protection on the bevel. This precise and tunable deposition helps resolve these common issues that may impact semiconductor quality.
Lam Research Corporate Vice President and India General Manager Rangesh Raghavan said in a complex manufacturing environment, increasing die yield is critical to maximizing fab productivity.
“Close collaboration with our customers is critical in developing innovative solutions like Coronus DX and driving improvement in chipmakers’ production processes,” said Lam Research Corporate Vice President and India General Manager Rangesh Raghavan.
CEA-Leti Semiconductor Platform Division Head Anne Roule said CEA-Leti applied its expertise in innovative, sustainable technology solutions to help Lam Research tackle key challenges in advanced semiconductor manufacturing.
“By simplifying 3D integration, Coronus DX drives significantly higher yield and enables chipmakers to adopt breakthrough production processes,” said CEA-Leti Semiconductor Platform Division Head Anne Roule.
Proprietary Process Drives Yield Improvement
Coronus DX enables best-in-class precision wafer centering and process control, including integrated metrology, to ensure consistency and repeatability of the process. Coronus products incrementally increase wafer yield, delivering an additional 0.2 to 0.5 percent of yield per etch or deposition step, which can result in up to 5 percent improvement across the wafer flow. Manufacturers running more than 100,000 wafer starts per month may yield millions of extra die with Coronus – potentially worth millions of dollars – over the course of a year.
Every Major Chipmaker Uses Coronus
First introduced in 2007, the Coronus product line is used by every major semiconductor manufacturer, with several thousand chambers installed globally. Lam’s Coronus product family is the industry’s first mass production-proven bevel technology.
Its Coronus and Coronus HP solutions are etch products designed to prevent defects by removing layers along the edge. Coronus solutions are used in the manufacturing of logic, memory and specialty devices, including leading-edge 3D devices. Coronus DX is now being used in high-volume manufacturing at leading customer fabs around the world.
Kioxia Corporation Memory Process Technology Executive Hideshi Miyajima said improving quality in the production process through advancements in areas such as bevel technology is essential to provide next-generation flash memory at scale to our customers.
“We look forward to continuing to work with Lam Research and its Coronus solutions to enable leading-edge wafer production,” said Kioxia Corporation Memory Process Technology Executive Hideshi Miyajima.
About Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customers to build smaller and better performing devices. In fact, today nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com.
